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Career Opportunities
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Princeton Lightwave Inc. specializes in infrared optics applications focused on imaging & sensing. The company has industry leading expertise in areas of SWIR focal plane arrays, detectors, high power lasers, and packaging, and is embarking on an initiative aimed at product leadership in the above applications.
The culture at Princeton Lightwave is a simple one – we are here to win, and we will do it with the right mix of talent, and an environment that unleashes this talent to succeed. We offer competitive salaries and benefits, as well as stock options and 401K.
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Send us your resume, and we'll see if you're qualified for any
of our open positions. Please submit your resume
by e-mail to hr@princetonlightwave.com if possible, or else mail it to us at:
Princeton Lightwave, Inc.
ATTN: Human Resources
2555 Route 130 South,
Suite 1
Cranbury, NJ 08512
We are currently looking to staff the following positions. |
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Firmware/Hardware Engineer July 20, 2011
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| Firmware/Hardware Engineering position responsible for developing new products and designs for optics based applications in infrared imaging.
Skill Sets:
- 3-5 years of DSP related firmware development, preferably on Analog Devices 21XX series DSPs and Altera PLDs
- Strong programming knowledge – C++, DSP Assembly, Matlab, Source code control
- Understanding of DSP and microcontroller hardware design
- Understanding of optics and signal processing fundamentals
- Experience with optoelectronic communications and instrumentation systems testing
- Development and implementation of software/firmware architectures
- Excellent documentation skills
- Real-time implementation and trouble shooting skills
Qualifications: B.S./M.S. in Computer Science and/or Electrical Engineering
To apply for this job, please send your resume to hr@princetonlightwave.com.
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Packaging Engineer – Optoelectronic Devices July 20, 2011
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We are looking for opto-mechanical packaging talent that can help unleash the market leading performance of our detectors and lasers. The ideal candidate is one who is passionate about optical packaging and product delivery in a fast paced, dynamic environment, and can drive concept and detailed design of all packaging aspects of our products. Experience in integration of optical chips, fiber, bulk optics, electronics and cooling to deliver high performance products is critical. Desirable functional skill sets include:
- Mechanical design
- Opto-mechanics and opto-electronic integration skills
- Thermal analysis
- Materials engineering
- Process knowledge in areas of flip chip bonding, wire bonding, die bonding and laser
welding
Qualifications: Preferred educational background includes a M.S. in Mechanical or Materials Engineering.
To apply for this job, please send your resume to hr@princetonlightwave.com.
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Technical Associate August 09, 2011
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Perform packaging and
characterization of
semiconductor laser
diodes/modules and detectors.
Preferred packaging skills
include die bonding,
wedge/wire/ribbon bonding, fiber
alignment, laser welding and
vacuum reflow. Desirable
characterization skills include
material inspection, device
performance testing, burn-in and
reliability. The candidate
should have experience in the
opto-electronic industry,
including the ability to read
and understand drawings and
bills of material, and ability
to handle micron level
components. Proficiency with
Microsoft software (Word, Excel)
required. Experience with
maintaining opto-electronic
production equipment a plus.
To apply for this job, please send your resume to hr@princetonlightwave.com.
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